Preheat Processes for Millisecond Anneal System

ABSTRACT

Preheat processes for a millisecond anneal system are provided. In one example implementation, a preheat process can include receiving a substrate on a wafer support plate in a processing chamber of a millisecond anneal system; obtaining one or more temperature measurements of the wafer support plate using a temperature sensor; and applying a preheat recipe to heat the wafer support plate based at least in part on the temperature of the wafer support plate. In one example implementation, a preheat process can include obtaining one or more temperature measurements from a temperature sensor having a field of view of a wafer support plate in a millisecond anneal system; and applying a pulsed preheat recipe to heat the wafer support plate in the millisecond anneal system based at least in part on the one or more temperature measurements.

PRIORITY CLAIM

Thus application claims the benefit of priority of U.S. ProvisionalApplication Ser. No. 62/272,811, filed on Dec. 30, 2015, titled“Pre-heat Processes for Millisecond Anneal System,” which isincorporated herein by reference.

FIELD

The present disclosure relates generally to thermal processing chambersand more particularly to millisecond anneal thermal processing chambersused for processing substrates, such as semiconductor substrates.

BACKGROUND

Millisecond anneal systems can be used for semiconductor processing forthe ultra-fast heat treatment of substrates, such as silicon wafers. Insemiconductor processing, fast heat treatment can be used as an annealstep to repair implant damage, improve the quality of deposited layers,improve the quality of layer interfaces, to activate dopants, and toachieve other purposes, while at the same time controlling the diffusionof dopant species.

Millisecond, or ultra-fast, temperature treatment of semiconductorsubstrates can be achieved using an intense and brief exposure of lightto heat the entire top surface of the substrate at rates that can exceed10⁴° C. per second. The rapid heating of just one surface of thesubstrate can produce a large temperature gradient through the thicknessof the substrate, while the bulk of the substrate maintains thetemperature before the light exposure. The bulk of the substratetherefore acts as a heat sink resulting in fast cooling rates of the topsurface.

SUMMARY

Aspects and advantages of embodiments of the present disclosure will beset forth in part in the following description, or may be learned fromthe description, or may be learned through practice of the embodiments.

One example aspect of the present disclosure is to a preheat process fora millisecond anneal system. The preheat process includes receiving asubstrate on a wafer support plate in a processing chamber of amillisecond anneal system. The processing chamber is divided into a topchamber and a bottom chamber. The process includes obtaining one or moretemperature measurements of the wafer support plate using a temperaturesensor. The process includes apply a preheat recipe to heat the wafersupport plate based at least in part on the one or more temperaturemeasurements of the wafer support plate.

Another example aspect of the present disclosure is directed to atemperature measurement system for a millisecond anneal system. Thetemperature measurement system includes a far infrared temperaturesensor configured to obtain one or more temperature measurements of asemiconductor substrate in a millisecond anneal system at processtemperatures of less than about 450° C. The millisecond anneal systemcan include a processing chamber having a wafer plane plate. The waferplane plate can divide the processing chamber into a top chamber and abottom chamber. The temperature measurement system can include aprocessing circuit configured to process measurements from thetemperature sensor to determine a temperature of the semiconductorsubstrate at temperatures of less than about 450° C.

Yet another example aspect of the present disclosure is directed to apreheat process for a millisecond anneal system. The preheat processincludes obtaining one or more temperature measurements from atemperature sensor having a field of view of a wafer support plate in amillisecond anneal system. The millisecond anneal system has aprocessing chamber divided into a top processing chamber and a bottomprocessing chamber. The process includes applying a pulsed preheatrecipe to heat the wafer support plate in the millisecond anneal systembased at least in part on the one or more temperature measurements.There is no substrate located on the wafer support plate duringapplication of the pulsed heat recipe.

Variations and modification can be made to the example aspects of thepresent disclosure.

Other example aspects of the present disclosure are directed to systems,methods, devices, and processes for thermally treating a semiconductorsubstrate.

These and other features, aspects and advantages of various embodimentswill become better understood with reference to the followingdescription and appended claims. The accompanying drawings, which areincorporated in and constitute a part of this specification, illustrateembodiments of the present disclosure and, together with thedescription, serve to explain the related principles.

BRIEF DESCRIPTION OF THE DRAWINGS

Detailed discussion of embodiments directed to one of ordinary skill inthe art are set forth in the specification, which makes reference to theappended figures, in which:

FIG. 1 depicts an example millisecond anneal heating profile accordingto example embodiments of the present disclosure;

FIG. 2 depicts an example perspective view of a portion of an examplemillisecond anneal system according to example embodiments of thepresent disclosure;

FIG. 3 depicts an exploded view of an example millisecond anneal systemaccording to example embodiments of the present disclosure;

FIG. 4 depicts a cross-sectional view of an example millisecond annealsystem according to example embodiments of the present disclosure;

FIG. 5 depicts a perspective view of example lamps used in a millisecondanneal system according to example embodiments of the presentdisclosure;

FIG. 6 depicts example edge reflectors used in a wafer plane plate of amillisecond anneal system according to example embodiments of thepresent disclosure;

FIG. 7 depicts example reflectors that can be used in a millisecondanneal system according to example embodiments of the presentdisclosure;

FIG. 8 depicts an example arc lamp that can be used in a millisecondanneal system according to example embodiments of the presentdisclosure;

FIGS. 9-10 depict the operation of an example arc lamp according toexample embodiments of the present disclosure;

FIG. 11 depicts a cross-sectional view of an example electrode accordingto example embodiments of the present disclosure;

FIG. 12 depicts an example closed loop system for supplying water andgas (e.g., Argon gas) to example arc lamps used in a millisecond annealsystem according to example embodiments of the present disclosure;

FIG. 13 depicts an example temperature measurement system for amillisecond anneal system according to example embodiments of thepresent disclosure;

FIG. 14 depicts an example millisecond anneal system with tungstenhalogen lamps for heating the semiconductor substrate to an intermediatetemperature according to example embodiments of the present disclosure;

FIG. 0.15 depicts a flow diagram of an example process according toexample embodiments of the present disclosure;

FIG. 16 depicts an example processing chamber having a pyrometertemperature sensor configured to determine the temperature of the wafersupport plate according to example embodiments of the presentdisclosure;

FIG. 17 depicts a typical thermal emission spectrum associated withwafer support plate made from quartz;

FIG. 18 depicts a graphical representation of the wafer support platetemperature distribution by relaxation according to example embodimentsof the present disclosure;

FIG. 19 depicts a flow diagram of an example process according toexample embodiments of the present disclosure;

FIG. 20 depicts an example pulsed preheat recipe according to exampleembodiments of the present disclosure;

FIG. 21 depicts an example pulsed preheat recipe according to exampleembodiments of the present disclosure; and

FIG. 22 depicts an example millisecond anneal system having a farinfrared temperature sensor according to example embodiments of thepresent disclosure.

DETAILED DESCRIPTION

Reference now will be made in detail to embodiments, one or moreexamples of which are illustrated in the drawings. Each example isprovided by way of explanation of the embodiments, not limitation of thepresent disclosure. In fact, it will be apparent to those skilled in theart that various modifications and variations can be made to theembodiments without departing from the scope or spirit of the presentdisclosure. For instance, features illustrated or described as part ofone embodiment can be used with another embodiment to yield a stillfurther embodiment. Thus, it is intended that aspects of the presentdisclosure cover such modifications and variations.

Overview

Example aspects of the present disclosure are directed to preheatingprocesses for a millisecond anneal system to reduce first substrate(e.g., a silicon wafer) effects during millisecond thermal treatment ofa substrate. Aspects of the present disclosure are discussed withreference to a “wafer” or semiconductor wafer for purposes ofillustration and discussion. Those of ordinary skill in the art, usingthe disclosures provided herein, will understand that the exampleaspects of the present disclosure can be used in association with anyworkpiece, semiconductor substrate or other suitable substrate. Inaddition, use of the term “about” in conjunction with a numerical valueis intended to refer to within 10% of the stated numerical value.

Millisecond, or ultra-fast, thermal treatment of semiconductor waferscan be achieved using an intense and brief exposure of light (e.g., a“flash”) to heat the entire top surface of the wafer at rates that canexceed 10⁴° C. per second. A typical heat treatment cycle can include:(a) loading a cold semiconductor substrate into the chamber; (b) purgingthe chamber with, for instance, nitrogen gas (atmospheric pressure); (c)heating the semiconductor substrate to an intermediate temperature Ti;(d) millisecond heating by flash exposure of the top surface of thesemiconductor substrate, while the bulk of the wafer remains at T_(i);(e) rapid cool down by conductive cooling of the top surface of thesemiconductor substrate with the bulk of the semiconductor substratebeing the conductively coupled heat sink; (f) slow cool down of the bulkof the semiconductor substrate by thermal radiation and convection, withthe process gas at atmospheric pressure as cooling agent; and (g)transport the semiconductor substrate back to the cassette.

The exact parameters of the processing steps in a heat treatment cycle(e.g., duration, temperature set-point, heating rate, etc.) can beprescribed in a process recipe. The process recipe can be editable andcan be modified by a user. The recipe can be executed by one or moreelectronic system controllers at run time. The controller(s) can includeone or more processors and one or memory devices. The memory devices canstore the recipes as computer-readable instructions that when executedby the one or more processors cause the controller(s) to implement therecipe.

The system can have a number of pre-defined recipes stored in the one ormore memory devices. The type of application or heat treatment candetermine which recipe is executed. Semiconductor substrates can beloaded onto the system by way of a FOUP (Front Opening Unified Pods)containing a cassette holding, for instance, twenty-five semiconductorsubstrates or other suitable input mechanism. An entity of twenty fivesemiconductor substrates can constitute a “batch”, or a “lot” ofsemiconductor substrates. Typically a lot is processed with the sameprocess recipe. If there is no break between processing lots with thesame recipe, the system can be said to be running in a continuous mode.

As discussed in detail below, the process chamber in which such atreatment cycle is carried out can include: (1) a wafer support platemade out of, for instance, quartz glass; (2) chamber walls made out ofhigh reflective, water cooled aluminum plates; (3) top and bottom waterwindows transparent for the heating light, made out of water cooledquartz plates. Except for the wafer support plate, all components of thechamber can be actively cooled and can remain at constant temperaturethroughout the thermal treatment of the semiconductor substrate. Thewafer support plate, in some embodiments, is not actively cooled.

When starting with a cold system, each heat treatment cycle heats thewafer support plate when the semiconductor substrate is heated and coolsit during the cool down phase of the cycle. As the heating phase istypically more dominant than the cooling phase, the average temperatureof the plate is increasing with each cycle until it reaches anequilibrium temperature. Until the equilibrium temperature is reached,every semiconductor substrate undergoing heat treatment sees a differentthermal radiation background, affecting the thermal budget of thetreatment process and therefore the process result. In order to achievegood repeatability, a cold process chamber may need to be preheated tothe equilibrium temperature. This can be accomplished by executing theprocess recipe on a number of preheat dummy wafers. For instance sixpreheat dummy wafers can be used for this purpose and can be run beforethe first lot is being processed. When the system is running incontinuous mode, no preheat dummy wafers are needed, as the wafersupport plate is automatically staying at equilibrium temperature.

A downside of dummy-wafers is that preheat dummy wafers are required andthe preheat cycle takes up a considerable amount of processing time.This can be especially true when the system cannot be kept running incontinuous mode or a variety of applications have to be run, eachrequiring a different equilibrium temperature of the wafer supportplate. As a result, preheat dummy wafers may have to be run in betweenlots.

Example aspects of the present disclosure are directed to reducingpreheat processing time and/or reducing the number of dummy wafers topreheat the processing chamber to an equilibrium temperature. In thisway, the efficiency of operation of the millisecond anneal system can beimproved.

For example, one example embodiment is directed to a preheat process fora millisecond anneal system. The process can include receiving asubstrate on a wafer support plate in a processing chamber of amillisecond anneal system. The processing chamber can be divided into atop chamber and a bottom chamber. The process can include obtaining oneor more temperature measurements of the wafer support plate using atemperature sensor; and applying a preheat recipe to heat the wafersupport plate based at least in part on the one or more temperaturemeasurements of the wafer support plate.

Variations and modifications can be made to this example embodiment. Forinstance, in some embodiments, the wafer support plate can be a quartzmaterial. In some embodiments, the substrate can include a dummysemiconductor substrate.

In some embodiments, applying a preheat recipe to heat the wafer supportplate based at least in part on the one or more temperature measurementsof the wafer support plate can include applying the preheat recipe toheat the wafer support plate until the temperature of the wafer supportplate reaches a pre-set temperature. When the wafer support platereaches the pre-set temperature, the process can include: stopping thepreheat recipe; and applying a process recipe to a second substrate inthe processing chamber. The process recipe is different than the preheatrecipe.

In some embodiments, the preheat recipe specifies heating the wafersupport plate and the substrate using one or more continuous mode lampslocated proximate to the bottom processing chamber in the millisecondanneal system. The one or more continuous mode lamps are controlledbased at least in part on the one or more temperature measurements ofthe wafer support plate.

In some embodiments, the temperature sensor can include a pyrometerhaving a measurement temperature associated with wavelengths greaterthan about 4 μm. In some embodiments, the temperature sensor is locatedin the bottom chamber and has a field of view of the wafer support platewithout obstruction by a water window of the millisecond anneal system.

Another example embodiment of the present disclosure is directed to atemperature measurement system for a millisecond anneal system. Thetemperature measurement system can include a far infrared temperaturesensor configured to obtain one or more temperature measurements of asemiconductor substrate in a millisecond anneal system at processtemperatures of less than about 450° C., such as less than about 300°C., such as less than about 250° C. The millisecond anneal system caninclude a processing chamber having a wafer plane plate. The wafer planeplate can divide the processing chamber into a top chamber and a bottomchamber. The temperature measurement system can include a processingcircuit configured to process measurements from the temperature sensorto determine a temperature of the semiconductor substrate attemperatures of less than about 450° C., such as less than about 300°C., such as less than about 250° C.

In some embodiments, the far infrared temperature sensor includes apyrometer associated with a spectral range of about 8 μm to about 14 μm.In some embodiments, the far infrared temperature sensor is mounted in acorner of the top chamber of a millisecond anneal system. The farinfrared temperature sensor can be unobstructed by a water window of themillisecond anneal system.

In some embodiments, the temperature measurement system further includesa second temperature sensor configured to measure a temperature of awafer support plate in the millisecond anneal system. The secondtemperature sensor can be located in the bottom processing chamber andhaving a field of view of the wafer support plate.

Another example embodiment of the present disclosure is directed to apreheat process for a millisecond anneal system. The preheat process caninclude obtaining one or more temperature measurements from atemperature sensor having a field of view of a wafer support plate in amillisecond anneal system. The millisecond anneal system can have aprocessing chamber divided into a top processing chamber and a bottomprocessing chamber. The process includes applying a pulsed preheatrecipe to heat the wafer support plate in the millisecond anneal systembased at least in part on the one or more temperature measurements.There is no substrate located on the wafer support plate duringapplication of the pulsed heat recipe. In some embodiments, the wafersupport plate is a quartz material.

In some embodiments, applying a pulsed preheat recipe to heat the wafersupport plate based at least in part on the temperature of the wafersupport plate comprises applying the preheat recipe to heat the wafersupport plate until the temperature of the wafer support plate reaches apre-set temperature. When the wafer support plate reaches the pre-settemperature, the process can include: stopping the preheat recipe; andapplying a process recipe to a second substrate in the processingchamber. The process recipe is different than the preheat recipe.

In some embodiments, the pulsed preheat recipe can specify a pluralityof pulses of heating light. In some embodiments, the temperature sensorcan include a pyrometer having a measurement temperature associated withwavelengths greater than about 4 μm.

Example Millisecond Anneal Systems

An example millisecond anneal system can be configured to provide anintense and brief exposure of light to heat the top surface of a waferat rates that can exceed, for instance, about 10⁴° C./s. FIG. 1 depictsan example temperature profile 100 of a semiconductor substrate achievedusing a millisecond anneal system. As shown in FIG. 1, the bulk of thesemiconductor substrate (e.g., a silicon wafer) is heated to anintermediate temperature T_(i) during a ramp phase 102. The intermediatetemperature can be in the range of about 450° C. to about 900° C. Whenthe intermediate temperature T_(i) is reached, the top side of thesemiconductor substrate can be exposed to a very short, intense flash oflight resulting in heating rates of up to about 10⁴° C./s. Window 110illustrates the temperature profile of the semiconductor substrateduring the short, intense flash of light. Curve 112 represents the rapidheating of the top surface of the semiconductor substrate during theflash exposure. Curve 116 depicts the temperature of the remainder orbulk of the semiconductor substrate during the flash exposure. Curve 114represents the rapid cool down by conductive of cooling of the topsurface of the semiconductor substrate by the bulk of the semiconductorsubstrate acting as a heat sink. The bulk of the semiconductor substrateacts as a heat sink generating high top side cooling rates for thesubstrate. Curve 104 represents the slow cool down of the bulk of thesemiconductor substrate by thermal radiation and convection, with aprocess gas as a cooling agent.

An example millisecond anneal system can include a plurality of arclamps (e.g., four Argon arc lamps) as light sources for intensemillisecond long exposure of the top surface of the semiconductorsubstrate—the so called “flash.” The flash can be applied to thesemiconductor substrate when the substrate has been heated to anintermediate temperature (e.g., about 450° C. to about 900° C.). Aplurality of continuous mode arc lamps (e.g., two Argon arc lamps) canbe used to heat the semiconductor substrate to the intermediatetemperature. In some embodiments, the heating of the semiconductorsubstrate to the intermediate temperature is accomplished through thebottom surface of the semiconductor substrate at a ramp rate which heatsthe entire bulk of the wafer.

FIGS. 2 to 5 depict various aspects of an example millisecond annealsystem 80 according to example embodiments of the present disclosure. Asshown in FIGS. 2-4, a millisecond anneal system 80 can include a processchamber 200. The process chamber 200 can be divided by a wafer planeplate 210 into a top chamber 202 and a bottom chamber 204. Asemiconductor substrate 60 (e.g., a silicon wafer) can be supported bysupport pins 212 (e.g., quartz support pins) mounted to a wafer supportplate 214 (e.g., quartz glass plate inserted into the wafer plane plate210).

As shown in FIGS. 2 and 4, the millisecond anneal system 80 can includea plurality of arc lamps 220 (e.g., four Argon arc lamps) arrangedproximate the top chamber 202 as light sources for intense millisecondlong exposure of the top surface of the semiconductor substrate 60—theso called “flash.” The flash can be applied to the semiconductorsubstrate when the substrate has been heated to an intermediatetemperature (e.g., about 450° C. to about 900° C.).

A plurality of continuous mode arc lamps 240 (e.g., two Argon arc lamps)located proximate the bottom chamber 204 can be used to heat thesemiconductor substrate 60 to the intermediate temperature. In someembodiments, the heating of the semiconductor substrate 60 to theintermediate temperature is accomplished from the bottom chamber 204through the bottom surface of the semiconductor substrate at a ramp ratewhich heats the entire bulk of the semiconductor substrate 60.

As shown in FIG. 3, the light to heat the semiconductor substrate 60from the bottom arc lamps 240 (e.g., for use in heating thesemiconductor substrate to an intermediate temperature) and from the toparc lamps 220 (e.g., for use in providing millisecond heating by flash)can enter the processing chamber 200 through water windows 260 (e.g.,water cooled quartz glass windows). In some embodiments, the waterwindows 260 can include a sandwich of two quartz glass panes betweenwhich an about a 4 mm thick layer of water is circulating to cool thequartz panes and to provide an optical filter for wavelengths, forinstance, above about 1400 nm.

As further illustrated in FIG. 3, process chamber walls 250 can includereflective mirrors 270 for reflecting the heating light. The reflectivemirrors 270 can be, for instance, water cooled, polished aluminumpanels. In some embodiments, the main body of the arc lamps used in themillisecond anneal system can include reflectors for lamp radiation. Forinstance, FIG. 5 depicts a perspective view of both a top lamp array 220and a bottom lamp array 240 that can be used in the millisecond annealsystem 200. As shown, the main body of each lamp array 220 and 240 caninclude a reflector 262 for reflecting the heating light. Thesereflectors 262 can form a part of the reflecting surfaces of the processchamber 200 of the millisecond anneal system 80.

The temperature uniformity of the semiconductor substrate can becontrolled by manipulating the light density falling onto differentregions of the semiconductor substrate. In some embodiments, uniformitytuning can be accomplished by altering the reflection grade of smallsize reflectors to the main reflectors and/or by use of edge reflectorsmounted on the wafer support plane surrounding the wafer.

For instance, edge reflectors can be used to redirect light from thebottom lamps 240 to an edge of the semiconductor substrate 60. As anexample, FIG. 6 depicts example edge reflectors 264 that form a part ofthe wafer plane plate 210 that can be used to direct light from thebottom lamps 240 to the edge of the semiconductor substrate 60. The edgereflectors 264 can be mounted to the wafer plane plate 210 and cansurround or at least partially surround the semiconductor substrate 60.

In some embodiments, additional reflectors can also be mounted onchamber walls near the wafer plane plate 210. For example, FIG. 7depicts example reflectors that can be mounted to the process chamberwalls that can act as reflector mirrors for the heating light. Moreparticularly, FIG. 7 shows an example wedge reflector 272 mounted tolower chamber wall 254. FIG. 7 also illustrates a reflective element 274mounted to reflector 270 of an upper chamber wall 252. Uniformity ofprocessing of the semiconductor substrate 60 can be tuned by changingthe reflection grade of the wedge reflectors 272 and/or other reflectiveelements (e.g., reflective element 274) in the processing chamber 200.

FIGS. 8-11 depict aspects of example upper arc lamps 220 that can beused as light sources for intense millisecond long exposure of the topsurface of the semiconductor substrate 60 (e.g., the “flash”). Forinstance, FIG. 8 depicts a cross-sectional view of an example arc lamp220. The arc lamp 220 can be, for instance, an open flow arc lamp, wherepressurized Argon gas (or other suitable gas) is converted into a highpressure plasma during an arc discharge. The arc discharge takes placein a quartz tube 225 between a negatively charged cathode 222 and aspaced apart positively charged anode 230 (e.g., spaced about 300 mmapart). As soon as the voltage between the cathode 222 and the anode 230reaches a breakdown voltage of Argon (e.g., about 30 kV) or othersuitable gas, a stable, low inductive plasma is formed which emits lightin the visible and UV range of the electromagnetic spectrum. As shown inFIG. 9, the lamp can include a lamp reflector 262 that can be used toreflect light provided by the lamp for processing of the semiconductorsubstrate 60.

FIGS. 10 and 11 depict aspects of example operation of an arc lamp 220in millisecond anneal system 80 according to example embodiments of thepresent disclosure. More particularly, a plasma 226 is contained withina quartz tube 225 which is water cooled from the inside by a water wall228. The water wall 228 is injected at high flow rates on the cathodeend of the lamp 200 and exhausted at the anode end. The same is true forthe Argon gas 229, which is also entering the lamp 220 at the cathodeend and exhausted from the anode end. The water forming the water wall228 is injected perpendicular to the lamp axis such that the centrifugalaction generates a water vortex. Hence, along the center line of thelamp a channel is formed for the Argon gas 229. The Argon gas column 229is rotating in the same direction as the water wall 228. Once a plasma226 has formed, the water wall 228 is protecting the quartz tube 225 andconfining the plasma 226 to the center axis. Only the water wall 228 andthe electrodes (cathode 230 and anode 222) are in direct contact withthe high energy plasma 226.

FIG. 11 depicts a cross sectional view of an example electrode (e.g.,cathode 230) used in conjunction with an arc lamp according to exampleembodiments of the present disclosure. FIG. 11 depicts a cathode 230.However, a similar construction can be used for the anode 222.

In some embodiments, as the electrodes experience a high heat load, oneor more of the electrodes can each include a tip 232. The tip can bemade from tungsten. The tip can be coupled to and/or fused to a watercooled copper heat sink 234. The copper heat sink 234 can include atleast a portion the internal cooling system of the electrodes (e.g., oneor more water cooling channels 236. The electrodes can further include abrass base 235 with water cooling channels 236 to provide for thecirculation of water or other fluid and the cooling of the electrodes.

The arc lamps used in example millisecond anneal systems according toaspects of the present disclosure can be an open flow system for waterand Argon gas. However, for conservation reasons, both media can becirculated in a close loop system in some embodiments.

FIG. 12 depicts an example closed loop system 300 for supplying waterand Argon gas needed to operate the open flow Argon arc lamps used inmillisecond anneal systems according to example embodiments of thepresent disclosure.

More particularly, high purity water 302 and Argon 304 is fed to thelamp 220. The high purity water 302 is used for the water wall and thecooling of the electrodes. Leaving the lamp is a gas/water mixture 306.This water/gas mixture 306 is separated into gas free water 302 and dryArgon 304 by separator 310 before it can be re-fed to the inlets of thelamp 220. To generate the required pressure drop across the lamp 220,the gas/water mixture 306 is pumped by means of a water driven jet pump320.

A high power electric pump 330 supplies the water pressure to drive thewater wall in the lamp 220, the cooling water for the lamp electrodes,and the motive flow for the jet pump 320. The separator 310 downstreamto the jet pump 320 can be used extracting the liquid and the gaseousphase from the mixture (Argon). Argon is further dried in a coalescingfilter 340 before it re-enters the lam 220. Additional Argon can besupplied from Argon source 350 if needed.

The water is passing through one or more particle filters 350 to removeparticles sputtered into the water by the arc. Ionic contaminations areremoved by ion exchange resins. A portion of water is run through mixedbed ion exchange filters 370. The inlet valve 372 to the ion exchangebypass 370 can be controlled by the water resistivity. If the waterresistivity drops below a lower value the valve 372 is opened, when itreaches an upper value the valve 372 is closed. The system can containan activated carbon filter bypass loop 380 where a portion of the watercan be additionally filtered to remove organic contaminations. Tomaintain the water temperature, the water can pass through a heatexchanger 390.

Millisecond anneal systems according to example embodiments of thepresent disclosure can include the ability to independently measuretemperature of both surfaces (e.g., the top and bottom surfaces) of thesemiconductor substrate. FIG. 13 depicts an example temperaturemeasurement system 150 for millisecond anneal system 200.

A simplified representation of the millisecond anneal system 200 isshown in FIG. 13. The temperature of both sides of a semiconductorsubstrate 60 can be measured independently by temperature sensors, suchas temperature sensor 152 and temperature sensor 154. Temperature sensor152 can measure a temperature of a top surface of the semiconductorsubstrate 60. Temperature sensor 154 can measure a bottom surface of thesemiconductor substrate 60. In some embodiments, narrow band pyrometricsensors with a measurement wavelength of about 1400 nm can be used astemperature sensors 152 and/or 154 to measure the temperature of, forinstance, a center region of the semiconductor substrate 60. In someembodiments, the temperature sensors 152 and 154 can be ultra-fastradiometers (UFR) that have a sampling rate that is high enough toresolve the millisecond temperature spike cause by the flash heating.

The readings of the temperature sensors 152 and 154 can be emissivitycompensated. As shown in FIG. 13, the emissivity compensation scheme caninclude a diagnostic flash 156, a reference temperature sensor 158, andthe temperature sensors 152 and 154 configured to measure the top andbottom surface of the semiconductor wafers. Diagnostic heating andmeasurements can be used with the diagnostic flash 156 (e.g., a testflash). Measurements from reference temperature sensor 158 can be usedfor emissivity compensation of temperature sensors 152 and 154

In some embodiments, the millisecond anneal system 200 can include waterwindows. The water windows can provide an optical filter that suppresseslamp radiation in the measurement band of the temperature sensors 152and 154 so that the temperature sensors 152 and 154 only measureradiation from the semiconductor substrate.

The readings of the temperature sensors 152 and 154 can be provided to aprocessor circuit 160. The processor circuit 160 can be located within ahousing of the millisecond anneal system 200, although alternatively,the processor circuit 160 may be located remotely from the millisecondanneal system 200. The various functions described herein may beperformed by a single processor circuit if desired, or by othercombinations of local and/or remote processor circuits.

As will be discussed in detail below, the temperature measurement systemcan include other temperature sensors, such as a temperature sensorconfigured to obtain one or more temperature measurements of a wafersupport plate (e.g., as shown in FIG. 16) and/or a far infraredtemperature sensor (e.g., as shown in FIG. 22) configured to obtain oneor more temperature measurements of a semiconductor substrate attemperatures below, for instance, about 450° C., such as less than about300° C., such as less than about 250° C. The processor circuit 160 canbe configured to process measurements obtained from the temperaturesensors to determine a temperature of the semiconductor substrate and/orthe wafer support plate.

An alternative source for heating the semiconductor substrate to anintermediate temperature T_(i) can be an array of tungsten halogen lampslocated in the bottom processing chamber. For instance, two continuousmode arc lamps can each have each an electrical power of 125 kW for atotal power of 250 kW. An array of 40 tungsten halogen lamps with 6 kWeach can provide the same power. FIG. 14 depicts an example millisecondanneal system with tungsten halogen lamps 245 for heating thesemiconductor substrate 60 to the intermediate temperature T_(i). Anadvantage of heating with halogen lamps is an economical one. Tungstenhalogen lamps can be less expensive and can have a much longer lifetime.Also the tungsten halogen lamps can only require electrical connections,omitting the need for expensive water cooling and water treatment units.

Example Preheat Processes for Chamber Pre-Conditioning

According to example aspects of the present disclosure, the time and thenumber of preheat dummy wafers needed to preheat the chamber can bereduced through use of a wafer support plate temperature measurementsystem to determine when the equilibrium temperature has been reached.For example, in some embodiments, the wafer support plate can be heatedby applying heat to a dummy wafer with a special preheat recipe. As soonas the wafer support plate temperature a desired temperature, thepreheat recipe execution can be stopped and the process recipe executionwith the first device wafer in the wafer lot can commence.

FIG. 15 depicts a flow diagram of an example process (400) according toexample embodiments of the present disclosure. The process (400) can beimplemented in a millisecond anneal system, such as one of the examplemillisecond anneal systems discussed with reference to FIGS. 1-14. FIG.15 depicts steps performed in a particular order for purposes ofillustration and discussion. Those of ordinary skill in the art, usingthe disclosures provided herein, will understand that various steps ofany of the methods or processes described herein can be modified,adapted, expanded, omitted, and/or rearranged in various ways withoutdeviating from the scope of the present disclosure.

At (402), the method includes receiving a semiconductor substrate on awafer support plate in a processing chamber of a millisecond annealsystem. For instance, a dummy wafer can be received on wafer supportplate 214 in the process chamber 200 illustrated in FIGS. 2-4. Thesemiconductor substrate can be supported by support pins. The wafersupport plate can be made from a quartz material. For instance, thewafer support plate can be a quartz glass plate.

At (404), the process can include obtaining one or more temperaturemeasurements of the wafer support plate using a temperature sensor. FIG.16 depicts an example processing chamber 80 having a temperature sensor162 (e.g., a quartz pyrometer) configured to determine the temperatureof the wafer support plate 214 according to example embodiments of thepresent disclosure. As illustrated, the temperature sensor 162 ismounted on the bottom of the process chamber in one of the corners ofthe bottom chamber 204, such that the field of view of the temperaturesensor 162 is unobstructed by the semiconductor substrate 60 and thewater window 260. In some embodiments, the temperature sensor 162 can bedirected to the center of the wafer support plate 214.

In some embodiments, the temperature sensor 162 can be a pyrometer witha measurement wavelength beyond the transmission cut-off (e.g., greaterthan about 4 μm) of quartz. For instance, FIG. 17 depicts a typicalthermal emission spectrum 502 associated with wafer support plate madefrom quartz. As shown, beyond about 4 μm, the quartz of the supportplate is opaque and emits thermal radiation. The thermal radiation canbe measured pyrometrically by the temperature sensor 162 to determinethe temperature of the wafer support plate.

At (406) of FIG. 15, the process can include determining whether atemperature of the wafer support plate has reached a thresholdtemperature (e.g., pre-set temperature). The threshold temperature canbe associated with an equilibrium temperature of the wafer supportplate. If the temperature of the wafer support plate has not reached thethreshold temperature (e.g., is not greater than or equal to thethreshold temperature), the process (400) can include applying a preheatrecipe to heat the wafer support plate and the semiconductor substrate(e.g., the dummy wafer) as shown at (408) of FIG. 15. In someembodiments, a preheat recipe can use only the continuous mode lamps toheat a dummy wafer placed on the wafer support plate. In someembodiments, the lamps can be operated in closed loop control, with thesemiconductor substrate temperature and/or the wafer support platetemperature as control input.

In some embodiments, the heating cycle of the pre-recipe can include oneor more combinations of soak and spike wafer temperature set-points, aswell as flash heating using the flash lamps. In some embodiments, theheating cycle does not use a closed loop mode. Rather the continuousmode lamps are operated at a fixed power value in an open loop fashion.In some embodiments, the heating cycle of the preheat recipe includes acool-down phase before a heating phase to improve the start temperatureconsistency and thus to improve the repeatability of thepre-conditioning.

In the event the temperature of the wafer support plate has reached thethreshold temperature, the process (400) can include stopping thepreheat recipe (410). The process (400) can then include loading adevice semiconductor substrate (412) for processing and applying aprocess recipe to thermally treat the semiconductor substrate (414). Theprocess recipe can be different from the preheat recipe and can includea recipe for processing a device semiconductor substrate from a lot ofsemiconductor substrates.

Example Dummy Wafer Free Preheat Processes

According to example aspects of the present disclosure, a preheatprocess can be implemented that does not require preheat dummy wafers.The wafer support plate can be made out of quartz, which, by its opticalproperties, is not easily heated by light. In a millisecond annealsystem according to example embodiments of the present disclosure, arclamps (e.g., Argon arc lamps) can be used for processing semiconductorsubstrates. The lamp radiation emitted from the lamps can predominantlyinclude light at a wavelength shorter than 1.5 μm, which is thewavelength range transmitted by the water window. In other rapid thermalprocessing systems, the light sources can be tungsten halogen lamps atabout 3000K, where the peak of the spectrum is at about 1 μm. Quartzglass can be transparent to light up to about 2 μm with a transmissioncoefficient of greater than about 90%. As a result, the heating rate ofthe wafer support plate by direct absorption of lamp light from the arclamps is small.

In preheat processes using preheat dummy wafers, such as the processdepicted in FIG. 15, this difficulty can be avoided. In these exampleembodiments, lamp light is used to predominantly heat the semiconductorsubstrate, which is a good absorber for the lamp light in the UV up tothe near infra-red regime (e.g., about 0.2 μm to about 1 μm). Since thedummy wafer is re-emitting light in a wavelength range determined by itstemperature (Planck's law), the short-wavelength light of the heatingsource is converted to a long-wavelength range. For instance, asemiconductor substrate at 1000° C. emits nearly all of its radiation ina wavelength range of greater than about 2 μm, which is readily absorbedby the quartz material. The quartz wafer support plate is thereforeheated indirectly by the secondary radiation stemming from thesemiconductor substrate.

According to example embodiments of the present disclosure, a method ofheating the highly transparent quartz of the wafer support plate bylight without requiring the presence of semiconductor substrates isprovided. The process can make use of the same principles as the processof FIG. 15. For instance, the wafer support plate temperature ismeasured by, for instance, a quartz pyrometer sensor. A preheat recipecan be applied until a temperature of the wafer support plate reaches athreshold temperature (e.g., a temperature associated with anequilibrium temperature of the wafer support plate).

In systems where the heating sources are halogen lamps, the sensorsignal contains not only radiation coming from the wafer support plate,but also contains radiation from the light source itself. The wafersupport plate temperature can therefore only be measured accurately whenthe lamps are off.

In some applications, small pieces of silicon are part of the chamber.These small pieces of silicon remain inside the chamber even when thereis no semiconductor substrate in the chamber. Other than the quartzmaterial of the wafer support plate, these pieces of silicon are goodabsorbers of lamp light, are not actively cooled, and therefore canquickly reach a melting point temperature. The same is true for everyother material with a higher absorption rate of lamp light and a lowermelting point as quartz (e.g., rubber gaskets). Therefore, the maximallyallowable heating power can be determined by the material inside thechamber.

An additional difficulty of directly heating the quartz plate is thatthe thermal conduction of quartz is very small. Hence the temperaturedistribution of the quartz plate, when heated without a semiconductorsubstrate is different from the stationary case with the semiconductorsubstrate. The temperature distribution predominately assumes the shapeof the heating source. In cases of the secondary heating via thesemiconductor substrate, this is a circular pattern. In cases of directheating via linear heating sources (e.g., arc lamps and tungsten halogenlamps) this is a striped pattern.

A preheat process according to example aspects of the present disclosurecan overcome this difficulty by using a relaxation by cooldown by whichthe temperature distribution is evened out over time. For instance, FIG.19 depicts a graphical representation of the wafer support platetemperature distribution by relaxation. As shown, by thermal conduction,a striped thermal pattern formed by an array of lamps is averaged outduring cool down of the wafer support plate. More particularly, curve504 represents temperature of the wafer support plate as a function oflocation on the wafer support plate at a first time t1. Curve 506represents temperature of the wafer support plate as a function oflocation on the wafer support plate at a second time t2. Curve 506represents temperature of the wafer support plate as a function oflocation on the wafer support plate at a third time t3. Curve 508represents temperature of the wafer support plate as a function oflocation on the wafer support plate at a third time t4. As shown, astime passes from t1 to t4, the temperature distribution of the wafersupport plate approaches an average temperature 512 across the wafersupport plate.

The time needed for the temperature distribution to even out is governedby the thermal conductivity of the material and the temperaturedifference. This can be seen in Fourier's law of heat conduction (forsimplistic reasons in the one-dimensional form):

$q_{x} = {{- k}\frac{dT}{dx}}$

Q_(x): heat flux densityk: thermal conductivity of the materialdT/dx: temperature gradient

Heating the transparent quartz material of the wafer support plate canbe based on an isothermal chamber. In equilibrium, the substrate to beheated assumes the temperature of the walls of the isothermal chamber,and the temperature distribution can be uniform. In a first-orderapproximation, the millisecond anneal system according to exampleembodiments of the present disclosure can be an isothermal chamber dueto the high reflective chamber walls. Given a long enough time, anymaterial, regardless of its optical properties, will assume thetemperature of the heating source. In other words, since the heatinglight is trapped in the reflecting box of the chamber, there arenumerous passes through the wafer support plate, each pass absorbing,for instance, 10% of the light. Eventually all light is being absorbedand the wafer support plate is reaching the equilibrium temperature. Inan empty processing chamber with no semiconductor substrate to beprocessed, a dominant absorber can be the quartz of the wafer supportplate.

Example aspects of the present disclosure are directed to shortening thetime needed to reach equilibrium temperature to a few minutes. Toachieve this, the lamps can be operated in a pulsed manner. The heatingpower of each pulse can be much higher than the heating power necessaryto reach the equilibrium temperature in the un-pulsed case(over-heating). In between heating pulses the temperature distributioncan relax by thermal diffusion. Since the thermal gradient is high, thetime needed for relaxation is much shorter than in the un-pulsed case.After a number of pulses, the wafer support plate can reach an average,uniform temperature.

FIG. 19 depicts a flow diagram of an example process (600) according toexample embodiments of the present disclosure. The process (600) can beimplemented in a millisecond anneal system, such as one of the examplemillisecond anneal systems discussed with reference to FIGS. 1-14. FIG.19 depicts steps performed in a particular order for purposes ofillustration and discussion. Those of ordinary skill in the art, usingthe disclosures provided herein, will understand that various steps ofany of the methods or processes described herein can be modified,adapted, expanded, omitted, and/or rearranged in various ways withoutdeviating from the scope of the present disclosure. The process (600)can be performed without a semiconductor substrate located on the wafersupport plate.

At (602), the process can include obtaining one or more temperaturemeasurements of the wafer support plate using a temperature sensor. Forinstance, temperature measurements of the wafer support plate can beobtained from the temperature sensor 162 of FIG. 16.

At (604) of FIG. 19, the process can include determining whether atemperature of the wafer support plate has reached a thresholdtemperature (e.g., pre-set temperature). The threshold temperature canbe associated with an equilibrium temperature of the wafer supportplate. If the temperature of the wafer support plate has not reached thethreshold temperature (e.g., is not greater than or equal to thethreshold temperature), the process (600) can include applying a pulsedpreheat recipe to heat the wafer support plate as shown at (606) of FIG.19.

FIG. 20 depicts a graphical representation of example pulsed preheatrecipe to accelerate the time needed for the wafer support plate toreach equilibrium temperature and uniform temperature distribution. Moreparticularly, curve 520 represents pulsed heating of lamps to implementthe pulsed preheat recipe according to example aspects of the presentdisclosure. Curve 522 represents the temperature of the wafer supportplate in response to pulsed heating of lamps. In some exampleembodiments, the heating power of the pulses is such that the heat loadspecification of the chamber is not exceeded. The number of pulses canbe between 10 and 100 and the total time of the preheat cycle is 3 to 4minutes.

In some embodiments, the pulsed heating can be controlled based at leastin part on temperature measurements by a temperature sensor (e.g.,pyrometer) configured to measure the temperature of the wafer supportplate. As the temperature sensor signal is also affected by the lamplight and is only measuring a small region on the wafer support plate,the temperature sensor signal may not be equal to the average waferplate temperature. In some embodiments, the lamp power is switched offwhen the temperature sensor signal reaches an upper limit and isswitched on when the quartz pyrometer reaches a lower limit.

For instance, FIG. 20 depicts the example pulsed preheating of a wafersupport plate based on temperature measurements of the wafer supportplate by a temperature sensor according to example embodiments of thepresent disclosure. Curve 540 represents pulsed heating of lamps toimplement the pulsed preheat recipe according to example aspects of thepresent disclosure. As illustrated, if the signal 550 from thetemperature sensor reaches an upper limit 552, the pulsed heating isturned off. When the signal 550 from the temperature sensor reaches alower limit 554, the pulsed heating is turned on. After several cycles,an average temperature represented by curve 560 that is generallyuniform across the wafer support plate is achieved.

In some embodiments, the time to reach equilibrium temperature can beshortened by “over-heating” with constant power and shutting off whenthe temperature sensor signal reaches a target temperature. The pulsedover-heating method can have several advantages over the non-pulsedover-heating. For instance, the average temperature can be independentof the duration of the preheat cycle or the number of pulses. Inaddition, the pulsed preheat method can also work in cases where thequartz temperature sensor signal is compromised by parasitic signals.

Referring to FIG. 19, in the event the temperature of the wafer supportplate has reached the threshold temperature, the process (600) caninclude stopping the preheat recipe (610). The process (600) can theninclude loading a device semiconductor substrate (612) for processingand applying a process recipe to thermally treat the semiconductorsubstrate (614). The process recipe can be different from the preheatrecipe and can include a recipe for processing a device semiconductorsubstrate from a lot of semiconductor substrates.

Example Low Temperature Control Using Temperature Sensor Measurements ofWafer Support Plate

Another example aspect of the present disclosure is directed to reducinga minimum intermediate temperature at which the millisecond annealsystem can operate by using a temperature sensor in the far infrared. Asdiscussed above, typical temperature sensors used to measure thetemperature of a semiconductor substrate during thermal processinginclude UFRs. UFRs typically use a wavelength of 1.45 μm to determinethe temperature of the semiconductor substrate. At this wavelength,lightly doped silicon is transparent below about 450° C. Accordingly,UFR temperature sensors cannot be used for measuring temperatures below450° C.

According to example embodiments of the present disclosure, a farinfrared temperature sensor (e.g., quartz pyrometer temperature sensor)can be used to measure the temperature of the semiconductor substrate.The sensor can have a spectral range in the far infrared of about 8 μmto about 14 μm, which is in a range where the emissivity of silicon atlow temperatures is non-zero and a radiation signal can be picked up.

In some embodiments, the far-infrared temperature sensor can be mountedin one of the corners in a top chamber of the millisecond anneal systemsuch that its field of view is not obstructed by a water window. Forinstance, FIG. 22 depicts an example location of a far-infraredtemperature sensor 164 in a corner of a top chamber 202 of millisecondanneal system 80 according to example embodiments of the presentdisclosure. The temperature sensor 164 can have a field of view of thesubstrate 60 mounted in the processing chamber without obstruction by awater window.

In some embodiments, a sensor mounted on the bottom half chamber and isdirectly measuring the temperature the wafer support plate, which isthermally coupled to the silicon wafer. An advantage of measuring thewafer support plate rather than the semiconductor substrate directly isthat the wafer emissivity is dependent on the device pattern and canvary, whereas the emissivity of the quartz wafer support plate isconstant.

While the present subject matter has been described in detail withrespect to specific example embodiments thereof, it will be appreciatedthat those skilled in the art, upon attaining an understanding of theforegoing may readily produce alterations to, variations of, andequivalents to such embodiments. Accordingly, the scope of the presentdisclosure is by way of example rather than by way of limitation, andthe subject disclosure does not preclude inclusion of suchmodifications, variations and/or additions to the present subject matteras would be readily apparent to one of ordinary skill in the art.

1-9. (canceled)
 10. A temperature measurement system for a millisecondanneal system, the system comprising: a far infrared temperature sensorconfigured to obtain one or more temperature measurements of a substratein a millisecond anneal system at process temperatures of less thanabout 450° C., the millisecond anneal system comprising a processingchamber having a wafer plane plate, the wafer plane plate dividing theprocessing chamber into a top chamber and a bottom chamber; a processingcircuit configured to process measurements from the temperature sensorto determine a temperature of the substrate at temperatures of less thanabout 450° C.
 11. The temperature measurement system of claim 10,wherein the far infrared temperature sensor comprises a pyrometerassociated with a spectral range of about 8 μm to about 14 μm.
 12. Thetemperature measurement system of claim 10, wherein the far infraredtemperature sensor is mounted in a corner of the top chamber of amillisecond anneal system.
 13. The temperature measurement system ofclaim 12, wherein the far infrared temperature sensor is unobstructed bya water window of the millisecond anneal system.
 14. The temperaturemeasurement system of claim 10, wherein the temperature measurementsystem further comprises a second temperature sensor configured tomeasure a temperature of a wafer support plate in the millisecond annealsystem, the second temperature sensor located in the bottom processingchamber and having a field of view of the wafer support plate.
 15. Apreheat process for a millisecond anneal system, the preheat processcomprising: obtaining one or more temperature measurements from atemperature sensor having a field of view of a wafer support plate in amillisecond anneal system, the millisecond anneal system having aprocessing chamber divided into a top processing chamber and a bottomprocessing chamber; applying a pulsed preheat recipe to heat the wafersupport plate in the millisecond anneal system based at least in part onthe one or more temperature measurements; wherein there is no substratelocated on the wafer support plate during application of the pulsed heatrecipe.
 16. The preheat process of claim 15, wherein the wafer supportplate comprises a quartz material.
 17. The preheat process of claim 15,wherein applying a pulsed preheat recipe to heat the wafer support platebased at least in part on the temperature of the wafer support platecomprises applying the preheat recipe to heat the wafer support plateuntil the temperature of the wafer support plate reaches a pre-settemperature.
 18. The preheat process of claim 17, wherein when the wafersupport plate reaches the pre-set temperature, the process comprises:stopping the preheat recipe; applying a process recipe to a secondsubstrate in the processing chamber, the process recipe being differentfrom the preheat recipe.
 19. The preheat process of claim 15, whereinthe pulsed preheat recipe specifies a plurality of pulses of heatinglight.
 20. The preheat process of claim 15, wherein the temperaturesensor comprises a pyrometer having a measurement temperature associatedwith wavelengths greater than about 4 μm.